Monthly Archives: March 2013
Semi Dice, Inc. and Cree, Inc. Sign Distribution Agreement for Silicon Carbide-Based Power Products in Wafer and Bare Die Form
March 7, 2013
Semi Dice, Inc., industry leading wafer and bare die supplier and Cree, Inc. market leader in silicon carbide (SiC) semiconductor components announces worldwide distribution agreement for SiC bare die power products. Click to view full press release.