Product Change Notices
The following PCN alerts are the current notifications we have received from our semiconductor partners. If you have any questions regarding these updates, please call a SemiDice salesperson or click the link below.
Call 800 345-6633 or Request Information
Wolfspeed SiC devices with increased Ti thickness in the topside Ti/TiN/AlCu metal layer
Fairchild Wafer Fabrication and Wafer Size Change
Fairchild Data Book change 2N7002
Central Semiconductor CP707 to CP727V (die and geometry change)
-Knowles Novacap C0GNPO Dielectric Introduction
ON Semiconductor TCAW0372 Wafer Size Change
Vishay Dale Resistor Series Consolidation of Mfg. Lines
Vishay PLT Series Resistors, singulation process change
Novacap Commercial Product Mfg. Location Change
Central Geometry CP188 & CP588 changed to CP388 & CP788 (die shrink)
Central Geometry CP517 changed to CP527 (Die Shrink)
Fairchild lists products that will move from 5″& 6″ to 6″& 8″ wafer fabs
Fairchild lists products that will remain on 6″ fab in Salt Lake, not move to 8″ fab
Vishay Schottky Diodes moving to 6″ wafers. No die size change
Vishay IRLC110B, 440B, 220B fab site Change
Vishay lists products with additional fab capacity at Tower Jazz fab in Israel
Vishay Schottky Diodes moving to 6″ wafers. No die size change
Fairchild PCN on P/N PCF76129 from ASMC fab to Mountain Top fab
Central Geometry CP207 changed to CP396V (slight die shrink)
Central Geometry CP716V changed to CP736V ( die shrink)
ADI PCN: AD549 ESD Improvement
PCN_0359 ONSemi MainDoc_P722AAB_53127
Microsemi Lawrence Chips_MSP16-006
Microsemi Final_PDN_for_1N4614-1
Microsemi DPG-RFMW-TS_2018-001_PDN_Letter
ON Semi/Fairchild PDN PD22637X