Industry Links and Terms
International Microelectronics and Packaging Society (IMAPS)
Ag | Silver |
Al | Aluminum |
Au | Gold |
Bare Die | Unpackaged integrated circuit die |
Bumped Die | Unpackaged integrated circuit that has interconnect material formed in contact with the I/O to allow flip-chip attachment. |
COB (Chip on Board) | A bare die that is attached to a rigid substrate face up and electrically interconnected to the substrate using wire bond technology. |
COF (Chip on Flex) | A bare die that is attached to a flexible laminate substrate active side up and electrically interconnected to the substrate,using wire bond technology. |
CSP | Chip Scale Package |
C4 | Controlled-Collapse Chip Connection |
DCA | Direct Chip Attachment |
DPC | Die Product Consortia |
EMI | Electromagnetic Interference |
ESD | Electrostatic Discharge |
Eutectic Solder | 63% Tin, 37% Lead |
FCP | Few Chip Package |
Film Frame | Sawn wafer on sticky tape supported by a metal frame |
Flip Chip | A method for electrically interconnecting unpackaged die active side down with a conductive bump to the substrate. |
Gel-PakĀ® | Plastic trays used to ship unpackaged die. The die is held in place by surface tension of membrane. A vacuum chuck is,required to reduce surface tension and remove die. |
HDI | High Density Interconnect |
I/O | Input/Output |
IC | Integrated Circuit |
JEDEC | Joint Electronic Device Engineering Council |
LTCC | Low-Temperature Co-fired Ceramic |
MCM | Multi-Chip Module |
MCP | Multi-Chip Package |
MIL-STD-883 | Military standard defining test methods and process procedures for microelectronic devices |
Mv | Microvia technology creates a PC board via of <=150um (typically by non-mechanical means) and uses built-up multi-layer processes. |
uBGA | Micro Ball Grid Array package |
uSMD | Micro Surface Mount Device |
Pb | Lead |
PWB | Printed Wiring Board |
RF | Radio Frequency |
S Level | Wafer fabrication processing and quality requirements per MIL-PRF-38535 |
SCD | Source Control Drawing |
SEM | Scanning Electron Micrograph |
SiP | System in a Package |
SOC | System on a Chip |
SMD | Surface-Mount Device |
Sn | Tin |
SPC | Statistical Process Control |
TAB | Tape Automated Bonding |
Tape on Reel | A high volume automated shipping method for automated assembly processing available on 7″ or 13″ reels |
Tg | Glass transition temperature |
UBM | Under Bump Metallurgy |
UV | Ultraviolet |
Waffle Packs | Plastic trays with individualized pockets designed for a specific die size |
Wirebond | A method for electrically connecting the die bond pad to the substrate trace typically using Au or Al bond wires |
WL-CSP | Wafer-Level Chip Scale Package |
WLP | Wafer-Level Packaging |