Component Design & Packaging
Plastic & Hermetic ICs, MCMs, and advanced 2.5/3D integration packaging technologies
More infoElectrical Testing
Leading capabilities and expertise for ICs used in analog, digital, mixed and RF signal processing applications
More infoEnvironmental Testing
Complete environmental testing solutions including HTOL/LTOL, HAST, HTSL, THB and many others
More infoReliability Testing
Application specific reliability plans designed for suitability of use, interaction in subsystems, field use, and storage conditions
More infoComponent Inspection
Acoustic Microscopy, X-Ray, X-Ray Fluorescence and IPC-A-610 inspection services
More infoUp-Screening
Utilize the latest COTS technologies in space. Complete turnkey solutions for PEM-Qualification
More infoTape & Reel Screening
Tape & Reel is one method to transport the die to the customer. The tape has cavities that each holds a single die
More infoBGA Reballing
A process that flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls
More infoLead Attach
Proprietary process developed to maintain the integrity of component-to-PCB solder joints under stress
More infoCGA Attach
Choose from various shipment options with the ability to customize to specifications
More infoTrim/Form & Reconditioning
Choose from various shipment options with the ability to customize to specifications
More infoMarking, Labeling, & Kitting
Devices can be identified as altered by ink dot, laser etch, and other physical marking methods
More infoSupplier Managed Inventory
Procurement, holding and management, BOM monitoring, modification/testing, holding of finished goods, delivery to customer defined location
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