| Glossary of Acronyms, Terms & Abbreviations |
| Ag |
Silver |
| Al |
Aluminum |
| Au |
Gold |
| Bare Die |
Unpackaged integrated circuit die |
| Bumped Die |
Unpackaged integrated circuit that has interconnect material formed in contact with the I/O to allow flip-chip attachment. |
| COB (Chip on Board) |
A bare die that is attached to a rigid substrate face up and electrically interconnected to the substrate using wire bond technology. |
| COF (Chip on Flex) |
A bare die that is attached to a flexible laminate substrate active side up and electrically interconnected to the substrate using wire bond technology. |
| CSP |
Chip Scale Package |
| C4 |
Controlled-Collapse Chip Connection |
| DCA |
Direct Chip Attachment |
| DPC |
Die Product Consortia |
| EMI |
Electromagnetic Interference |
| ESD |
Electrostatic Discharge |
| Eutectic Solder |
63% Tin, 37% Lead |
| FCP |
Few Chip Package |
| Film Frame |
Sawn wafer on sticky tape supported by a metal frame |
| Flip-Chip |
A method for electrically interconnecting unpackaged die active side down with a conductive bump to the substrate. |
| Gel-Pak® |
Plastic trays used to ship unpackaged die. The die is held in place by surface tension of membrane. A vacuum chuck is required to reduce surface tension and remove die. |
| HDI |
High Density Interconnect |
| I/O |
Input/Output |
| IC |
Integrated Circuit |
| JEDEC |
Joint Electronic Device Engineering Council |
| LTCC |
Low-Temperature Co-fired Ceramic |
| MCM |
Multi-Chip Module |
| MCP |
Multi-Chip Package |
| MIL-STD-883 |
Military standard defining test methods and process procedures for microelectronic devices |
| Mv |
Microvia technology creates a PC board via of <=150um (typically by non-mechanical means) and uses built-up multi-layer processes. |
| uBGA |
Micro Ball Grid Array package |
| uSMD |
Micro Surface Mount Device |
| Pb |
Lead |
| PWB |
Printed Wiring Board |
| RF |
Radio Frequency |
| S Level |
Wafer fabrication processing and quality requirements per MIL-PRF-38535 |
| SCD |
Source Control Drawing |
| SEM |
Scanning Electron Micrograph |
| SiP |
System in a Package |
| SOC |
System on a Chip |
| SMD |
Surface-Mount Device |
| Sn |
Tin |
| SPC |
Statistical Process Control |
| TAB |
Tape Automated Bonding |
| Tape on Reel |
A high volume automated shipping method for automated assembly processing available on 7" or 13" reels |
| Tg |
Glass transition temperature |
| UBM |
Under Bump Metallurgy |
| UV |
Ultraviolet |
| Waffle Packs |
Plastic trays with individualized pockets designed for a specific die size |
| Wirebond |
A method for electrically connecting the die bond pad to the substrate trace typically using Au or Al bond wires |
| WL-CSP |
Wafer-Level Chip Scale Package |
| WLP |
Wafer-Level Packaging |
