Die Products Consortium Profile

The Die Products Consortium (DPC) is a group of leading microelectronics companies collaborating to advance the widespread adoption of die products, including bare die, flip chip die and wafer level CSP. Since 1998, the DPC has provided leadership to the IC industry for developing methods that improve die product quality, reliability, handling, shipping, and associated infrastructure at lowest cost.

Through the DPC, business managers and technology experts engage in cooperative information-sharing in order to gain a common understanding of issues and opportunities related to die products technologies. Examples of DPC project topics include System-in-Package Technologies, Analog & RF Test Methods, and Fault Modeling & Test Coverage Description. The DPC also takes an active role in the development of international standards for die products. The DPC is open to new members.

As a service to the industry, the DPC maintains a website full of free resources for die products practitioners, including market data, standards information, a supplier database, and technology tutorials on known good die processes, shipping & handing, assembly methods, and inspection criteria.

The DPC hosts the annual KGD Packaging & Test Workshop each year in Napa, California to focus on the latest die products test, assembly, manufacturing, and business issues. The workshop attracts international participation representing all aspects of the industry, and provides a comprehensive learning experience through timely technical sessions, informative tutorials, world-class exhibits, and engaging social events.

KGD Packaging & Test Workshop link: www.napakgd.com

For more information about the DPC, please visit our website at www.dieproducts.org or contact Larry Gilg, Managing Director at 512-452-0077.