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Texas Instruments acquired National Semiconductor’s Die Products group who has been supporting die sales for the company since 1995.
Located in South Portland, Maine, the DPG has the
responsibility for releasing TI's standard products in die form as well as supporting
all of TI's product lines in the release of new products in die form. The DPG's strategy is
to leverage TI's analog expertise and bare die capabilities with the intent of supplying die
products into small form factor applications.
Small form factor applications are often characterized by one or both of the requirements for cost reduction and high reliability. To support these requirements the DPG has several quality levels available (ei. commercial, military, space, etc.) that will meet most customers needs. In addition, the centralize group concept for obtaining TI die products ensures standardization from the customer perspective.
The DPG offers the advantage of a wide range of die products and the support information required. Support information includes but is not limited to
Device specific die datasheets
Technical support
Extended temperature range guarantees
Samples
Shipping/delivery options for both wafer and die including wafer on film-frame, gel paks, waffle packs, and tape-on-reel.
Analysis of Die Assembly Techniques (pdf)
Die - The Ultimate Small Form Factor Package (pdf)
To request more information, click here for literature about this supplier. To request a quote, click here.
For more information, please visit: http://www.ti.com
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