Authorized Distributor of California Micro Devices Capacitors – Semi Dice
Passive Die Components > California Micro Devices Corporation
Although CMD has exited the bare die market, Semi Dice still has residual inventory available. Click here to view the excess inventory still available.

California Micro Devices Corporation (Nasdaq:CAMD) is a leading supplier of Application Specific Integrated Passive™ (ASIP) networks and related analog semiconductors. Within the company's broad product line are highly integrated solutions that ensure signal integrity, EMI (electromagnetic interference) filtering, ESD (electrostatic discharge) protection and smart power management for a broad spectrum of computing, communications, medical and lighting applications.


Products and Technology

ASIP™ Chip Solutions

Our ASIP chip solutions, which employ precision thin-film techniques, exemplify the technology expertise and broad product line offered by California Micro Devices. Whether delivered as wafers or die, or in chip scale format or traditional plastic packages, our ASIP products exploit advanced thin-film technology to achieve most effective integrations of both passive and active components into a single chip. Besides utilizing precision thin-film technology, virtually all of our new ASIP products are offered in the chip scale format to deliver superior performance and reduce both component count and total cost of ownership.

Analog Semiconductors

Leveraging our proficiency in analog circuit design, we are increasingly integrating analog functions into our line of ASIP products. While our analog expertise is clearly evident in the chip solutions we currently offer for smart power management and network interface cards, we expect it to become even more apparent as we continue to wed high-performance analog functions to our world-class ASIPs to create highly integrated solutions for mobile electronics, computing, and consumer electronics markets.

Chip Scale Packaging (CSP)

As an early adopter of space-saving Chip Scale Packaging (CSP), we are a licensee of the Ultra™ CSP technology from Flip Chip Technologies (FCT), the CSP technology leader. Moreover, we have invested in state-of-the-art ball drop and tape-and-reel machines, making us one of the most capable CSP producers in the world. CSP offers significant advantages to our customers, particularly those manufacturing PDAs, wireless handsets, and other portable consumer products faced with severe space constraints. CSP also provides better electrical performance, easy placement of the product in the assembly process, and improved reliability.

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